Size | Machinable size | FPC | Single Size：230*800mm；Multilayers：200*400mm |
Rigid-Flex | 200*500mm(Over size requires review) | ||
Drill | Drill Tolerance | Max.Hole Size | 6.4mm |
Min.Hole Size | 0.03mm | ||
Min.Slot Size | 0.6mm（＜0.6mm Laser cut） | ||
Hole Position Tolerance | First Drill +/-0.05 mm Secondary Drill +/-0.1 mm | ||
Finished holes Tolerance | PTH Tol：+/-0.05 mm NPTH Tol：+0.025/-0.05 mm | ||
Plating | Hole Cu Thickness | FPC-2L | ≥8um |
FPC-Multilayer | ≥15um | ||
Rigid-Flex | ≥20um | ||
refer to customers special requirements | |||
Surface Cu Thickness | Standard | 10-25um | |
Traces | Width/Space | Min.Rings | 0.1mm |
1OZ Min.Width/Space | 1L：0.08mm/0.07mm(after compensation) | ||
2L：0.09mm/0.075mm(after compensation) | |||
1/2 OZ Min.Width/Space | 0.07mm/0.07mm（after compensation） | ||
1OZ Etching Compensation | 0.04mm | ||
1/2 OZ Etching Compensation | 0.03mm | ||
1/3 OZ Etching Compensation | 0.02mm | ||
NPTH Min.Holes to Traces | 0.2mm | ||
Layers | Design | FPC | 0-6L |
Rigid-Flex | 2-20L | ||
Traces | Alignment | Alignment deviation of two sided graphics | +/-0.075mm |
Coincidence accuracy | +/-0.075mm | ||
Single side alignment accuracy | +/-0.05mm | ||
DES | Etching Tolerance | +20% | |
丝印 | Solder mask | Mask Alignment Accuracy | ±0.2MM |
Min.Opening to Pad | 0.1mm | ||
Min.Mask Dam | 0.1mm | ||
Exposure Alignment Accuracy | +0.05mm | ||
Mask thickness | 10-25um | ||
Silver | Min.Distance edge to trace | 0.2 mm | |
Silkscreen | Min.Text Height | 0.8mm(Better 1.0mm) | |
Min.Text Width | 0.1mm | ||
Min.Silscreen Width | ≥0.1mm | ||
Min.Silkscreen Height | ≥0.80mm | ||
Min.Distance between Text | 0.15mm | ||
Min.Silk-Pad | 0.2mm | ||
Min.White Silk-Pad | 0.2mm | ||
Coverlay | Coverlay | Min.Coverlay Opening | 0.4mm |
Min.Steel Holes | 0.6mm | ||
Min.Cutting Holes | 0.7mm | ||
Min.Square Opening(Steel) | 0.6*0.6mm | ||
Min.Square Opening(Knife) | 1.2*1.2mm | ||
Min.Square Opening(Laser) | 0.5mm*0.5mm | ||
Min.Distance (Drill) | 0.2mm | ||
Min.Distance (Steel) | 0.5mm | ||
Min.Distance (Laser) | 0.2mm | ||
Opening to Pads | 0.2mm | ||
Alignment | Alignment Accuracy（handwork） | +0.2mm | |
Laminating | Spill amount | ＜0.2mm | |
Surface | Hard gold | Ni Thickness | 1-7um |
Au Thickness | 0.05-0.5um | ||
Tin | Tin Thickness | 0.3-1.0um | |
OSP | OSP Thickness | 0.2-0.6um | |
ENIG | Ni Thickness | 1-7um | |
Au Thickness | 0.025-0.075um | ||
E-test | Fixture | Min.Probe（Special） | 0.3mm |
Min.Probe（General） | 0.2mm | ||
Min.Test Pads（Center to Center） | 0.6 mm | ||
Punching | CCD | Standard Holes | 2.0mm |
Target Accuracy | ±0.05mm |